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(R)
HFA3767
Data Sheet February 1998 FN4298.3
P RE L I M I N A RY
130MHz CDMA/AMPS Quadrature Modulator and AGC
The HFA3767 is a monolithic bipolar quadrature modulator with gain control for CDMA/AMPS cellular applications. An upconverter quadrature mixer and an output gain control stage with better than 70dB of dynamic range are integrated in the design. A local oscillator input requires low drive levels and a divide by two phase shifter with duty cycle compensation achieves excellent phase and amplitude balance properties. The HFA3767 is one of the four chips in the PRISMTM chip set and is housed in a 20 lead SSOP package ideally suited to cellular handset applications.
Features
* I/Q Amplitude and Phase Balance . . . . . . . . . . . 0.5dB, 2o * 130MHz AGC Amplifier/Attenuator range . . . . . . . .>70dB * Low LO Drive Level . . . . . . . . . . . . . . . . . . . . . . . .-10dBm * Power Enable/Disable Control * Single Supply Battery Operation . . . . . . . . . . . 2.7 to 3.3V
Applications
* IS95A CDMA/AMPS Dual Mode Handsets * Wideband CDMA Handsets * Full Duplex Transceivers * CDMA/TDMA Packet Protocol Radios * Portable Battery Powered Equipment
Ordering Information
PART NUMBER HFA3767IA HFA3767IA96 TEMP. RANGE (oC) -40 to 85 -40 to 85 PACKAGE 20 Ld SSOP Tape and Reel PKG. NO. M20.15
Pinout
HFA3767 (SSOP) TOP VIEW
TX_PE GND 1 2 3 20 VCC 19 AGC_CTRL 18 GC 17 AGC_VCC 16 TX_IF15 TX_IF+ 14 AGC_GND 13 CAP 12 LO_IN 11 LO_GND
Simplified Block Diagram
TXI TXI+ IF OUTPUT
TXI- 4
TXQ BIAS NETWORK
TX_PE
1
AGC_CTRL
IF LO
/2 0/90 o
NC TXQTXQ+ MIX_GND DPS_GND
5 6 7 8 9
DPS_VCC 10
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2002. All Rights Reserved PRISM(R) is a registered trademark of Intersil Americas Inc. PRISM and design is a trademark of Intersil Americas Inc.
HFA3767 Pin Descriptions
PIN NUMBER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 NAME TX_PE GND TXI+ TXINC TXQTXQ+ MIX_GND DPS_GND DPS_VCC LO_GND LO_IN CAP AGC_GND TX_IF+ TX_IFAGC_V CC GCT AGC_CTRL VCC DESCRIPTION Power enable control input. HIGH for normal operation. LOW for power down. Bias and AGC control ground return. Positive I channel baseband input. Requires a 1.2VDC common mode bias voltage. Negative I channel baseband input. Requires a 1.2VDC common mode bias voltage. No connect pin. Tie to ground to improve isolation from I to Q channels. Negative QI channel baseband input. Requires a 1.2VDC common mode bias voltage. Positive Q channel baseband input. Requires a 1.2VDC common mode bias voltage. Quadrature Mixers ground return. Digital Phase shifter ground return. Digital Phase Shifter Power Supply. Use high quality RF decoupling capacitors right at the pin. Local Oscillator Input ground return. Local Oscillator Current Input. Use a 50 power to current converter.See applications diagram. AGC Bias circuit filter capacitor. Typical value of 1000pF to 10000pF. AGC circuit ground return. Positive IF output port. Requires a DC return to VCC thru a choke or match inductor. Negative IF output port. Requires a DC return to VCC thru a choke or match inductor. AGC circuit Power Supply.Use high quality RF decoupling capacitors right at the pin. Gain and temperature compensation external resistor. See applications diagram. AGC control input. Require a 1% resistor divider at this input. See applications diagram. Bias and AGC control Power Supply.Use high quality RF decoupling capacitors right at the pin.
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HFA3767
Absolute Maximum Ratings
TA = 25oC
Thermal Information
Thermal Resistance (Typical, Note 1) JA ( oC/W) SSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . -65oC TA 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (Lead Tips Only)
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V Voltage on Any Other Pin . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Operating Conditions
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 3.3V Temperature Range. . . . . . . . . . . . . . . . . . . . . . .-40oC TA 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VCC = 2.7V to 3.3V, LO_IN = -10dBM at 260MHz. Refer to Applications diagram (NOTE 2) TEST LEVEL TEMP (oC)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
CDMA MODE SPECIFICATIONS: I AND Q INPUTS at 0.63VPP Sinusoidal, 500KHz in Quadrature (SSB Output) Output Power into 50 P1dBO/Output Power Ratio Output Noise Floor P1dBO/Output Power Ratio Output Noise Floor P1dBO/Output Power Ratio Output Noise Floor P1dBO/Output Power Ratio Output Noise Floor P1dBO/Output Power Ratio Output Noise Floor P1dBO/Output Power Ratio Output Noise Floor P1dBO/Output Power Ratio Output Noise Floor AGC_CTRL set for 70dB of attenuation AGC_CTRL set for 50dB of attenuation AGC_CTRL set for 40dB of attenuation AGC_CTRL set for 30dB of attenuation AGC_CTRL set for 20dB of attenuation Vagc = 0.5V , Output from 400 to 50 Differential to single end converter (0dB Attenuation) AGC_CTRL set for 10dB of attenuation A A B B B B B B B A B A B B B 25 Full 25 Full 25 25 25 25 25 Full 25 Full 25 25 25 -13.1 8 8 8 8 8 8 8 -12.7 12.4 -142.3 12.4 -144 12.4 -148.5 12.4 -153.4 12.4 -160 12.4 -163 12.4 -165 -12.3 -140 -162 dBm dB dBm/Hz dB dBm/Hz dB dBm/Hz dB dBm/Hz dB dBm/Hz dB dBm/Hz dB dBm/Hz
FM MODE SPECIFICATIONS Q INPUT ONLY at 0.44VPP DC Differential at Q Input. Commom Mode Voltage at I Input Output Power into 50 P1dBO/Output Power Ratio Output Noise Floor Vagc = 0.5V , Output from 400 to 50 Differential to single end converter (0dB Attenuation) A A B Full Full 25 -10.2 7 -9.76 10.2 -142.3 -9.3 -140 dBm dB dBm/Hz
GENERAL SPECIFICATIONS: I AND Q INPUTS at 0.63VPP Sinusoidal, 500kHz in Quadrature (SSB Output) AGC Gain Control Voltage AGC Gain Control Sensitivity AGC Gain Control Input Impedance AGC Switching Speed, Full Scale Externally set To 1dB Settling A B C B 25 25 25 25 0.5 50 18 2.4 10 V dB/V k s
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HFA3767
Electrical Specifications
VCC = 2.7V to 3.3V, LO_IN = -10dBM at 260MHz. Refer to Applications diagram (Continued) (NOTE 2) TEST LEVEL B B TEMP (oC) 25 25
PARAMETER AGC Insertion Phase IF Frequency Range
TEST CONDITIONS 20dB step Applications diagram
MIN -
TYP 1.6 130
MAX -
UNITS deg/dB MHz
GENERAL SPECIFICATIONS: I AND Q INPUTS at 0.63VPP Sinusoidal, 500kHz in Quadrature (SSB Output) TX_IF Single End Equivalent Series R TX_IF Single End Equivalent Series C Baseband Frequency Range LO Frequency Range Amplitude Balance (Note 3) Phase Balance (Note 3) Single Sideband Suppression Carrier Suppression (Vagc = 0.5V) (0dB attenuation) AGC_CTRL set for 20dB attenuation AGC_CTRL set for 70dB attenuation LO Input Impedance LO Drive Level LO Drive Optimal Current Range Baseband Differential Input Impedance VCM Common Mode Input Voltage Into I+, I-, Q+ and QSingle end Applications diagram Applications diagram Deviation from ideal SSB characteristics AGC_CTRL = 0.5V 130MHZ, IF+ or IF130MHz, IF+ or IFB B B A B B A A 25 25 25 25 25 25 Full 25 DC -0.5 -2 32 -30 115 4.9 260 35 1.0 +0.5 +2 W pF MHz MHz dB Degrees dBc dBc
A
25
-30
-
-
dBc
B
25
-29
-
-
dBc dBm Arms V
C A B C A
25 25 25 25 Full
50 2K 1.14
130 -10 200 1.20
300 1.26
POWER SUPPLY AND LOGIC SPECIFICATIONS Supply Voltage Range Supply Current at 3.3V AGC_CTRL = 0.5V AGC_CTRL = 2.4V Power Down Supply Current Power Down Speed TX_PE VIL TX_PE VIH TX_PE Input Bias Current at VCC = 3.3V PE = 2.0V PE = 0.66V, 2.7VCC NOTES: 2. A = Production Tested, B = Based on Characterization, C = By Design 3. I leading Q produces a positive frequency offset from the carrier (USB).Test garanteed by sideband suppression. TX_PE = Low B A A A B A A A A 25 Full Full 25 Full Full Full Full Full 2.7 2.0 -50 -50 3.3 40 25 100 10 0.8 +50 +50 V mA mA A s V V A A
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HFA3767 Applications Diagram
VCC .01 BEAD
.1
POWER ENABLE
1 TX_PE
0.03 VCC BIAS AGC_CTRL 3.6k 1% CONTROL GC 180n 180n 1000p 4.7p
15K 1% AGC_CTRL 3.6k 1%
GND I+ ITXI+ TXINC QQ+ TXQTXQ+
AGC_VCC TX_IFTX_IF+
IF+ IF-
MIX_GND 0o/90o DPS_GND 0.03 100p DPS_VCC /2
5
AGC_GND CAP LO_IN LO_GND
0.03 0.01
100p 4.7p MURATA LFSH33
220 1000p LO_IN 56
VCC
TEST OUTPUT NETWORK DIFFERENTIAL TO 50 SINGLE END CONVERTER (1.1dB INSERTION LOSS) 220n
220n TX_IF-
4p
50 OUTPUT MINI CIRCUITS. TC8-1
TX_IF+ 4p
HFA3767 Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA E -B1 2 3 L SEATING PLANE -AD -CA 0.25 0.010 h x 45o GAUGE PLANE H 0.25(0.010) M BM
M20.15
20 LEAD SHRINK NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B C MIN 0.053 0.004 0.008 0.007 0.337 0.150 MAX 0.069 0.010 0.061 0.012 0.010 0.344 0.157 MILLIMETERS MIN 1.35 0.10 0.20 0.18 8.56 3.81 MAX 1.75 0.25 1.54 0.30 0.25 8.74 3.98 NOTES 9 3 4 5 6 7 8o Rev. 0 5/96
A1 0.10(0.004) A2 C
D E e H h L N
e
B 0.17(0.007) M C AM BS
0.025 BSC 0.228 0.0099 0.016 20 0o 8o 0.244 0.0196 0.050
0.635 BSC 5.80 0.26 0.41 20 0o 6.19 0.49 1.27
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm (0.004 inch) total in excess of "B" dimension at maximum material condition. 10. Controlling dimension: INCHES. Converted millimeter dimensions are not necessarily exact.
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